Precision 2-part epoxy dispensing apparatus and method
US5801951A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 1997 |
| Grant date | Sep 1, 1998 |
| Priority date | — |
| Expiry date | Mar 18, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05C11/1007
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A liquid dispense system for dispensing a 2-part epoxy resin compound to form bond beads having weights on the order of 1-20 mg. The dispensing system includes an epoxy resin compound pre-mixing and loading station, an epoxy dispense time and dispense force calibration station, and a plurality of epoxy dispensing third stations. Throughout the process, critical dispense related data is recorded on, and retrieved from, an on-board semiconductor memory device mounted on, and maintained with, the portable dispense syringe structure. Since the viscosity of the mixed epoxy compound is changing over time, any dispensing of constant amounts of the epoxy compound requires adjustments to dispense time and dispense force. These adjustments are made at a dispense station and are based on a calibration sample taken at the calibration station. The calibration step involves dispensing a sample of the loaded epoxy compound in the dispense syringe, and recording data on the memory device pertaining to the number of shots dispensed to produce the sample, the time taken for each shot and the total weight of the sample. At a dispensing station, a process controller reads the recorded data on the memo…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.