Method of making a device including a metallized magnetic substrate
US5802702A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 4, 1997 |
| Grant date | Sep 8, 1998 |
| Priority date | — |
| Expiry date | Sep 4, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The method of making a metallized magnetic substrate for devices including a magnetic component involves providing an unfired ceramic body. In one exemplary embodiment, the method further involves making one or more vias through the ceramic body, coating the via side walls with conductive material, forming an aperture through the ceramic body, such that an aperture edge intersects the via, and metallizing the unfired ceramic body such that a conductive pathway is formed that includes the conductive material in the via. Finally, the metallized unfired ceramic body is fired in conventional fashion, optionally followed by deposition of additional conductor material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.