Method of finishing a printed wiring board with a soft etching solution and a preserving treatment or a solder-leveling treatment
US5802714A · kind A · utility
32Cited by
5References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 7, 1995 |
| Grant date | Sep 8, 1998 |
| Priority date | — |
| Expiry date | Jun 7, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention presents a method of finishing a printed circuit board by using a soluble chloride added to a soft etching solution, the soluble chloride provides a source of chloride ions that beneficially combine with plated copper to form a protective CuCl layer. The protective layer is desirably used to prevent overetching of a copper film in a via or through-hole of a printed wiring board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.