Method and device for continuous uniform electrolytic metallizing or etching
US5804052A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 26, 1996 |
| Grant date | Sep 8, 1998 |
| Priority date | — |
| Expiry date | Nov 26, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S204/07
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention relates to a method for continuous uniform electrolytic metallizing or etching of metal surfaces, and to a device suitable for carrying out this method. The invention is particularly suitable for treating printed circuit boards and conductive films in installations through which the metal surface being treated passes horizontally. In order to avoid metal coatings of differing thicknesses being deposited on narrow and wide conductor strips in printed circuit boards, according to the present invention operation is with movable, preferably rotating roller-shaped intermediate electrodes, which roll without short circuit at a very close effective distance above the metal surface being treated, or which contact the surface in a wiping manner. These intermediate electrodes are not electrically connected to the source of bath current, thus serving as bipolar electrodes, and are located between the surface being treated and a suitable counter-electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.