Method of forming a microstructure
US5804083A · kind A · utility
98Cited by
6References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 28, 1996 |
| Grant date | Sep 8, 1998 |
| Priority date | — |
| Expiry date | May 28, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0109
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Method of forming a complex, minute three-dimensional structure, known as micromachining, which includes forming a plurality of thin films at least one of which is provided as a temporary layer composed of a lower layer made of an organic material and an upper layer made of an amphoteric metal material which is formed on the lower layer; and selectively removing the temporary layer to provide a three-dimensional structure. The temporary layer may comprise a composite sacrificial layer of photoresist and aluminum.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.