Method and device for coating printed-circuit boards
US5804256A · kind A · utility
6Cited by
0References
10Claims
0Family size
Inventor
Key dates
| Filing date | Dec 23, 1996 |
| Grant date | Sep 8, 1998 |
| Priority date | — |
| Expiry date | Dec 23, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The method of forming a multilayer printed circuit board includes applying a photopolymerizable coating append having a solid content of 70 to 95% by weight and a viscosity of 10 to 60 Pa.s of 25.degree. C. to a surface of the applicator cooled to a temperature of 5.degree. C. by a metering roll surface of which is controllably maintained at a temperature range from 25.degree. to 60.degree. C., so that the coating agent is deposited on opposite sides of a board and has an application viscosity of 20 to 100 Pa.s at a coating speed of 5 to 20 m/min to form a film thickening of 10 to 200 .mu.m.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.