Hot melt adhesive compositions
US5804519A · kind A · utility
35Cited by
15References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 5, 1997 |
| Grant date | Sep 8, 1998 |
| Priority date | — |
| Expiry date | Nov 5, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/699
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A method for improving the strike through properties of hot melt adhesive compositions comprising the step of incorporating therein a nonionic fluorchemical surfactant in an amount of 0.1 to 10 parts by weight per 100 parts adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.