Curable organosiloxane compositions and semiconductor devices
US5804631A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 30, 1996 |
| Grant date | Sep 8, 1998 |
| Priority date | — |
| Expiry date | Jul 30, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A curable organosiloxane composition useable as a silicone die attach adhesive, an electrically conductive silicone rubber composition each comprising a composition that cures through both addition and condensation reactions, that will not impair wire bondability to a semiconductor chip or lead frame after the semiconductor chip has been bonded to a substrate or package; and semiconductor devices in which the semiconductor chip is bonded to its substrate or package using the curable organosiloxane composition and in which the semiconductor device that evidences high reliability by virtue of the use of the curable organosiloxane composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.