Patent · US Expired

Thermally crosslinkable heat-sealing adhesive

US5804672A · kind A · utility

15Cited by

4References

10Claims

0Family size

Assignee

Henkel Kommanditgesellschaft auf Aktien · DE

Inventors

Gerd Bolte · Monheim, DE
Gunter Henke · Katzenelnbogen, DE
Ulrike Bruninghaus · Erkrath, DE

Key dates

Filing date	Feb 29, 1996
Grant date	Sep 8, 1998
Priority date	—
Expiry date	Feb 29, 2016

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/1105
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

A mixture of an adduct of an epoxy resin and a novolak with an acrylate polymer, a modified bisphenol A or a polyol in conjunction with a polyisocyanate or a polyol of an OH-terminated polyurethane or polyester gives a heat-sealing adhesive combining high heat resistance and good hydrolysis stability with relatively high bond strengths. Accordingly, the composition is suitable above all as a base material and cover film for printed circuits.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.