Semiconductor device having a semiconductor chip electrically connected to a wiring substrate
US5804882A · kind A · utility
78Cited by
19References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 21, 1996 |
| Grant date | Sep 8, 1998 |
| Priority date | — |
| Expiry date | May 21, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/321
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device comprising a semiconductor chip, a wiring substrate, and an adhesive preferably containing electroconductive particles interposed therebetween, a plurality of spacer elements being present on or below the adhesive layer, said spacer elements having almost the same height as surrounding projecting electrodes and at least one shape selected from circles and polygons when viewed from the top, within an area surrounded by the connected electrodes, has a high flexural strength and high reliability and can be used for information cards, and the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.