Distributed transmission line structure
US5805037A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 1996 |
| Grant date | Sep 8, 1998 |
| Priority date | — |
| Expiry date | Dec 23, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09663
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A distributed transmission line structure (10) includes a ground plane (26) affixed to a substrate (12). The substrate (12) is formed of a generally nonconductive material. A first metallic strip (14) is affixed to the substrate (12) and is electrically connected to the ground plane (26) through a first through-hole (34). A second metallic strip (16) is affixed to the substrate (12) and is spaced apart from the first metallic strip (14) by a gap (28) and is electrically connected to the ground plane (26) through a second through-hole (38). A dielectric layer (20) overlies the substrate (12), the first metallic strip (14), and the second metallic strip (16). A third metallic strip (18) is affixed to the dielectric layer (20) and is disposed to overlie the gap (28). The third metallic strip (18) has a width less than the gap (28). The impedance of the distributed transmission line structure (10) is substantially constant over a predetermined range of thickness of the dielectric layer (20).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.