Semiconductor device
US5805865A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 26, 1996 |
| Grant date | Sep 8, 1998 |
| Priority date | — |
| Expiry date | Sep 26, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microcomputer chip is formed with a CPU core, a peripheral circuit, a built-in ROM, and a built-in RAM. An emulation functional chip is formed with an emulation control circuit for controlling the whole process of emulation. First electrode pads formed on the functional surface of the microcomputer chip are electrically interconnected to second electrode pads formed on the functional surface of the emulation functional chip with connecting bumps interposed therebetween. The microcomputer chip and the emulation functional chip are modularized using an insulating resin with the first electrode pads being connected to the second electrode pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.