Parting fixture for removal of a substrate from a mandrel
US5807472A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 13, 1997 |
| Grant date | Sep 15, 1998 |
| Priority date | — |
| Expiry date | Jan 13, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D1/20
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of separating an electroformed metal substrate from a mandrel includes establishing a parting gap between the electroformed metal substrate and the mandrel, attaching the electroformed metal substrate at a parabolic end of the mandrel to a parting fixture, and introducing a fluid through the parting fixture into an opening of the mandrel to effect separation of the electroformed metal substrate from the mandrel. The parting fixture includes a parabolically shaped outer cup with a fluid inlet tube extending through the bottom thereof. The parting fixture also preferably includes an inner cup for containing the fluid introduced through the fluid inlet tube and a vacuum device to effect attachment of the electroformed metal substrate to the parting fixture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.