Microetching method for copper or copper alloy
US5807493A · kind A · utility
34Cited by
9References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 24, 1996 |
| Grant date | Sep 15, 1998 |
| Priority date | — |
| Expiry date | Jul 24, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/125
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A microetching composition for copper or copper alloys comprising, (a) a cupric ion source, (b) an organic acid with an acid dissociation constant (pKa) of 5 or less, (c) a halide ion source, and (d) water. The composition can produce surfaces of copper or copper alloy exhibiting excellent adhesion to resins such as prepregs and resists and superior solderability. The composition can be very adaptable to the manufacture of printed wiring boards with highly integrated fine line patterns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.