Applying adhesive to substrates
US5807606A · kind A · utility
24Cited by
0References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 31, 1997 |
| Grant date | Sep 15, 1998 |
| Priority date | — |
| Expiry date | Jul 31, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Applying adhesive in a desired pattern on a substrate by determining one or more inspection sites for monitoring adhesive deposition, applying adhesive to a substrate with a stencil or screen printer, viewing the inspection sites with a camera that generates image signals, and processing the image signals to determine if adhesive has been properly applied at the inspection sites.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.