Lead frame of a semiconductor device and a method for designing it
US5808355A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 4, 1996 |
| Grant date | Sep 15, 1998 |
| Priority date | — |
| Expiry date | Jun 4, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates generally to a lead frame which is bended with a predetermined angle many times in order that a sectional area of a punch to form two lead lines which are located in the center of tie bars is increased, and increase the inertial moment as to a sectional area in making a lead frame of a desired shape. And the above-mentioned lead frame comprises a dambar; inner leads which has a certain angle at the part being below half the distance from lead tips to the above-mentioned dambar, and is connected to the above-mentioned dambar; outer leads which is connected to the above-mentioned dambar, and is populated on a circuit board; and tie bars which support the above-mentioned inner leads in case of taping.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.