Integrated circuit solder-rack interconnect module
US5808875A · kind A · utility
18Cited by
8References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 1997 |
| Grant date | Sep 15, 1998 |
| Priority date | — |
| Expiry date | Sep 29, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package that has no internal routing or vias within the substrate of the package. The package includes a substrate that has a plurality of bond pads and connecting contact pads located on an outer first surface of the substrate. An integrated circuit is mounted to the first surface and coupled to the bond pads. Mounted to the substrate is a solder rack which contains a plurality of contacts that couple the contact pads to an external printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.