Molding with improved foam attachment layer
US5810406A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 5, 1996 |
| Grant date | Sep 22, 1998 |
| Priority date | — |
| Expiry date | Mar 5, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C48/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention relates to moldings such as trim strips and, more particularly, to moldings comprising an outer layer and an inner layer which are bonded together mechanically by a plurality of mating lugs and recesses disposed along the interface of the two layers. Ideally, the materials utilized for the first and second layers will be sufficiently compatible such that adhesive bonding will also be accomplished between the layers, without generally requiring a separate adhesive be disposed therebetween. Various methods for manufacturing the moldings in accordance with the teachings of the present invention are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.