Single-cast, high-temperature, thin wall structures having a high thermal conductivity member connecting the walls and methods of making the same
US5810552A · kind A · utility
35Cited by
87References
37Claims
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Key dates
| Filing date | Jun 7, 1995 |
| Grant date | Sep 22, 1998 |
| Priority date | — |
| Expiry date | Jun 7, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T50/60
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Disclosed is an integral single-cast multi wall structure including a very thin wall and a second thin wall. There is a passageway interposed between the pair of walls of the structure, and a high thermal conductivity member extends into said passageways and thermally couples the walls. The high thermal conductivity member increases the heat transfer between the walls of the structure. The present invention further includes a method for casting an integral structure having very thin walls that utilizes the high thermally conductive member in the casting process to hold the pattern and cores in alignment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.