Adhesive wafer with embossed skin-contacting surface
US5811116A · kind A · utility
37Cited by
15References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 1996 |
| Grant date | Sep 22, 1998 |
| Priority date | — |
| Expiry date | Apr 30, 2016 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61F2013/4593
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
An adhesive wafer, which is especially suitable for use as a faceplate for an ostomy appliance but may also be used as a wound dressing, has an adhesive layer of hydrocolloid-containing skin barrier material and a flexible backing layer extending over one surface of the adhesive layer. The opposite skin-contacting surface of the adhesive layer is embossed to provide a pattern of discrete, non-connecting depressions separated and isolated from each other by flat-topped ridges dimensioned and arranged so that a skin surface engaged by said embossed surface primarily contacts only such ridges.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.