Photoelectric conversion device having thermal conductive member
US5811790A · kind A · utility
101Cited by
4References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 20, 1997 |
| Grant date | Sep 22, 1998 |
| Priority date | — |
| Expiry date | Feb 20, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/30
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a photoelectric conversion device including peripheral ICs, the peripheral ICs are in thermal contact with a substrate having photoelectric conversion elements and a chassis, which covers the peripheral ICs and has high thermal conductivity, via a thermal conductive member, so as to eliminate adverse influences of heat produced by the peripheral ICs such as a low S/N ratio.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.