Laser diode component with heat sink and method of producing a plurality of laser diode components
US5812570A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 30, 1996 |
| Grant date | Sep 22, 1998 |
| Priority date | — |
| Expiry date | Sep 30, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/4025
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A laser diode component includes a semiconductor body secured on a heat sink which includes a dissipator and an electrically and thermally conductive connection plate. The semiconductor body is secured to the connection plate, which in turn is applied to the dissipator. The connection plate is formed of a material having a coefficient of thermal expansion that is similar to the coefficient of thermal expansion of the semiconductor material of the semiconductor body. A connecting layer between the semiconductor body and the connection plate is preferably formed of hard solder. The dissipator is secured to the connection plate, for example through the use of a thermally conductive adhesive. A method for producing a plurality of laser diode components includes making many such laser diode components as a unit, and then subsequently cutting them apart.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.