Low temperature method for mounting electrical components
US5814180A · kind A · utility
8Cited by
11References
1Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 9, 1996 |
| Grant date | Sep 29, 1998 |
| Priority date | — |
| Expiry date | Aug 9, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2848
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for low temperature attachment of components is provided which uses an electrically conductive adhesive. The electrically conductive adhesive may be defined by a substrate having numerous passageways through the substrate. The passageways are defined by a plurality of walls of the material making up the substrate. The walls are covered with a layer of conductive metal. The passageways at the outer surfaces are filled with a non-conductive pressure sensitive adhesive resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.