Selectively filled adhesive film containing a fluxing agent
US5814401A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 4, 1997 |
| Grant date | Sep 29, 1998 |
| Priority date | — |
| Expiry date | Feb 4, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/287
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A selectively filled thermally curable adhesive film (10) contains a fluxing agent for reflow soldering an electronic device to a substrate. The adhesive film has a central, region (12) and a boundary region (14) surrounding the central region. The central region consists of an adhesive that is filled with an inert filler to reduce the co-efficient of thermal expansion of the adhesive. The boundary region consists of an unfilled adhesive and a fluxing agent. The film may be used to adhesively bond a flip chip semiconductor die (20) to a substrate (21). When solder bumps (22) on the die are reflowed, the fluxing agent acts to remove any oxides present on the solderable surfaces of the substrate or the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.