Semiconductor component
US5814870A · kind A · utility
33Cited by
9References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 6, 1997 |
| Grant date | Sep 29, 1998 |
| Priority date | — |
| Expiry date | Jan 6, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/852
Abstract
A semiconductor component has at least one semiconductor chip mounted on a carrier part of its housing. The semiconductor chip is electrically connected to at least two electrode connectors which are provided with contacts. The component housing has an upper housing portion and at least one housing side part which surround the semiconductor chip at least partially. The carrier part on which the semiconductor chip is mounted forms the upper housing portion of the component housing and the at least two electrode connectors at least partially form the housing side parts of the component housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.