Multi-function heat dissipator
US5815371A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 26, 1996 |
| Grant date | Sep 29, 1998 |
| Priority date | — |
| Expiry date | Sep 26, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus simultaneously supporting a circuit board and dissipating heat from an electrical device on the circuit board. In a computer including the circuit board and a mother board connected to the circuit board, a heat dissipator not only dissipates any heat produced by the electrical device, but also secures the circuit board to the mother board. The heat dissipator includes three frame plates and two support plates, each made of a thermally conductive material. The first frame plate is directly connected to the electrical device. The first and second frame plates are proximate to and parallel with the front and back faces of the circuit board, respectively and the third frame plate connects the first and second frame plates. The first and second support plates attach the first and second frame plates, respectively, to the mother board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.