Optical package with alignment means and method of assembling an optical package
US5815623A · kind A · utility
49Cited by
2References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 23, 1997 |
| Grant date | Sep 29, 1998 |
| Priority date | — |
| Expiry date | May 23, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical package is provided having a diode mounted to a substrate enclosed by a housing which includes a bore for receiving an optical waveguide and a focusing element adjacent the bore. The bore and focusing element are aligned along a common optical axis. An alignment means is associated with the housing for aligning the substrate along the optical axis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.