Method of fabricating electronic circuit device and apparatus for performing the same method
US5816473A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 22, 1995 |
| Grant date | Oct 6, 1998 |
| Priority date | — |
| Expiry date | Dec 22, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus comprises a sputter cleaning device, an alignment device operable in atmospheric condition and a heating and soldering device in the form of a belt furnace operable in non-oxidizing or reducing environment. Instead of the sputter cleaning device, a mechanical polishing or cutting device can be used to clean a surface of solder or a member to be bonded or a solder ball plated with gold may be used. An alignment between two members to be bonded is provided by an alignment mark means which comprises a protrusion on a surface of one member and a complimentary recess formed at a center portion of a protrusion means formed on a corresponding surface of the other member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.