Micro precise polishing apparatus

US5816899A · kind A · utility

Assignee

• Buehler AG · DE

Inventors

• Michael F. Hart · Mundelein, US
• Scott Holt · Goldkronach, DE

Key dates

• Filing date: Jul 22, 1996
• Grant date: Oct 6, 1998
• Expiry date: Jul 22, 2016

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B24B37/04
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

Apparatus and method for grinding semiconductor chips and other specimens prior to microscopic examination thereof by supporting a specimen on a specimen mount, fixing the specimen mount to a lower end of a lower arm, connecting an upper end of the lower arm to a swingable arm by a horizontal pivot which permits the lower arm and specimen mount to move upwardly and downwardly relative to the swingable arm, providing a stop to limit downward movement of the specimen mount relative to the swingable arm when the lower arm reaches a zero position, moving the swingable arm downwardly to lower the specimen to engage an underlying rotatable grinding platen to define a zero position, and continuing to move the swingable arm downwardly beyond the zero position by an amount corresponding to the amount of material to be removed from a lower portion of the specimen so that the stop will prevent removal of additional material.