Selective laser sintering of polymer powder of controlled particle size distribution
US5817206A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 7, 1996 |
| Grant date | Oct 6, 1998 |
| Priority date | — |
| Expiry date | Feb 7, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2333/06
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A powder for use in selective laser sintering, from which prototype articles and masters for molds may be formed, is disclosed. The powder is formed by spray drying a polymer emulsion to yield a distribution of particles of substantially spherical shape. The powder is then air classified to remove excessively small particles from the distribution; the powder may also be screened to remove large particles therefrom, as well. The resulting distribution of particle sizes, by volume, preferably has a mean particle size of between about 20.mu. and about 50.mu., with preferably less than about 5% (by volume) of its particles with a size of less than about 15.mu. and less than about 2% (by volume) of its particles with a size of greater than about 75.mu.. The powder is subjected to selective laser sintering to produce an article of approximately 55% to 75% of theoretical density. The article may be used as a prototype article or part, or as a pattern or master for a mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.