Method of applying a curable resin to a substrate for use in papermaking
US5817377A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 12, 1997 |
| Grant date | Oct 6, 1998 |
| Priority date | — |
| Expiry date | May 12, 2017 |
Classification
- Technology area (CPC D)Textiles; Paper
- CPC primaryD06N2209/1621
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The invention comprises a method for applying a curable resin, such as a photosensitive resin, to a substrate such as a papermaker's dewatering felt. The method comprises the steps of providing a substrate; providing a curable liquid resin; providing a second material different from the curable liquid resin; applying the second material to the substrate to occupy at least some of the voids in the substrate intermediate the first and second surfaces of the substrate; applying the curable resin to the substrate; curing at least some of the resin to provide a resin layer on the substrate; and removing at least some of the second material from the substrate, wherein at least some of the second material is removed from the substrate after applying the curable resin to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.