Encapsulated insulation assembly
US5817387A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 6, 1997 |
| Grant date | Oct 6, 1998 |
| Priority date | — |
| Expiry date | Feb 6, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24273
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A modularized, encapsulated insulation assembly includes a plurality of insulation modules which each include a compressible, resilient insulation material encapsulated within a vented, flexible envelope which overlays and encloses the major surfaces, lateral surfaces, and at least the end surfaces of the insulation material at the ends of insulation modules facing other modules of the assembly. Where both ends of the insulation material in an insulation module are enclosed within the envelope, the envelope is vented to permit air to pass through the envelope during the compression and recovery of the insulation module. Each adjacent pair of insulation modules is joined by a flexible connector strip which extends between adjacent ends of the insulation modules and lies either substantially in the plane of one of the major surfaces or about midway between the major surfaces of the insulation modules. The insulation modules may differ in length and provide a location between the insulation modules where utilities can pass when the modularized, encapsulated insulation assembly is installed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.