Multilayer resin molding utilizing coated resin moldings
US5817420A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Sep 30, 1996 |
| Grant date | Oct 6, 1998 |
| Priority date | — |
| Expiry date | Sep 30, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31913
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A multilayer resin molding, utilizing coated resin moldings, composed of a core material and a surface layer covering the core material, the core material being composed of a resin composition which comprises 100 parts by weight of a crushed material of coated polyolefin resin moldings compounded with from 3 to 15 parts by weight of an ethylene polymer having a weight average molecular weight of from 50,000 to 180,000 and the surface layer comprising a polypropylene resin composition comprising from 30 to 80% by weight of a propylene polymer, from 3 to 20% by weight of a propylene polymer modified with an unsaturated hydroxy compound, from 15 to 40% by weight of a thermoplastic elastomer, and from 0.1 to 10% by weight of an oligomer having a functional group at the terminal thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.