Apparatus and method for obtaining three-dimensional data from objects in a contiguous array
US5818061A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 1995 |
| Grant date | Oct 6, 1998 |
| Priority date | — |
| Expiry date | Sep 25, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2831
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and apparatus are provided for efficiently using 3-D vision systems to measure selected structural features of objects that have a uniform geometric arrangement. The method and apparatus are particularly well suited for optimizing the 3-D measurement of a multiple lead frame, leads of integrated circuit devices mounted on the multiple lead frame, and ball grid array integrated circuit devices on a wafer. For obtaining the three-dimensional data, corresponding sides of the multiple lead frames or devices are scanned sequentially in a row or column with at least one three dimensional sensor. This scanning procedure is repeated for all rows and columns containing structural features of the devices for which data are to be obtained. The acquired three-dimensional device geometry data are compared with the intended predetermined geometry to produce a signal indicative of a deviation of an actual device geometry from the intended predetermined geometry that exceeds a specified tolerance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.