Heat dissipating computer case having oriented fibers and heat pipe
US5818693A · kind A · utility
47Cited by
21References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 9, 1997 |
| Grant date | Oct 6, 1998 |
| Priority date | — |
| Expiry date | Jan 9, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/203
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The apparatus is a cooling structure for laptop computers, in which the heat is transferred to a heat pipe in the cover of the case behind the display screen. The heat pipe behind the screen is interconnected with the external wall of the cover by a holding fixture which, preferably, is integrated into the cover wall during manufacture. The cover is specially constructed with high thermal conductivity carbon fibers which are oriented to preferentially conduct heat from the heat pipe to the cover and to spread the heat over the entire external surface of the cover for dissipation into the environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.