Heat sink and spring clip assembly
US5818695A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 25, 1997 |
| Grant date | Oct 6, 1998 |
| Priority date | — |
| Expiry date | Feb 25, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink and spring clip assembly for removing heat from an electronic module and for holding the heat sink and electronic module to a circuit board, with the heat sink having a finned top surface, and a flat bottom surface larger than the electronic module for holding the electronic module between the bottom surface and the circuit board, with the bottom surface also having a downward extending leg at each corner, each leg ending with a foot for resting on the circuit board and holding the heat sink a fixed distance above the circuit board, and the spring clip for holding the heat sink to the circuit board having a substantially rectangular frame with two opposing torsion bar sides and two opposing leaf spring sides, the sides connected at four corners, and each corner having a downward extending leg with a latching notch for latching into a latching hole in the circuit board when the spring clip is pressed down over the heat sink and the leaf spring sides are compressed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.