Wire bend inspection method and apparatus
US5818958A · kind A · utility
3Cited by
8References
4Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Nov 25, 1996 |
| Grant date | Oct 6, 1998 |
| Priority date | — |
| Expiry date | Nov 25, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01006
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and apparatus for inspecting bends in wires bonded between, for instance, pads of semiconductor chips and leads of lead frames using detection ranges established within imaging ranges in which images of bends are taken. Imaging range areas are established by dividing the distance between a first bonding point and a second bonding point of a target wire by the width of the detection range, and the wire bend is then detected in the respective imaging range areas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.