Encapsulation of optoelectronic components

US5818990A · kind A · utility

Assignee

• Telefonaktiebolaget LM Ericsson (Publ) · SE

Inventors

• Odd Steijer · Bromma, SE
• Paul Eriksen · Djurås, SE
• Hans-Christer Moll · Stuvsta-Snättringe, SE
• Jan-åke Engstrand
• Goran Palmskog · Järfälla, SE
• Mats O. Janson · Port, CH
• Pia Tinghag · Vingåker, SE

Key dates

• Filing date: Jan 29, 1997
• Grant date: Oct 6, 1998
• Expiry date: Jan 29, 2017

Classification

• Technology area (CPC G): Physics
• CPC primary: G02B6/4257
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

An encapsulated optocomponent (1) comprises a single-crystal silicon wafer (3) and waveguides (9) located thereon, which at least partly are manufactured by means of process methods taken from the methods for manufacturing electronic integrated circuits. The waveguides (9) extend from an edge of the optoelectronic component (1) to an optoelectronic, active or passive component (11) attached to the surface of the silicon wafer (3). Over the region for connecting the waveguides (9) to the optoelectronic component (11) a transparent plastics material is molded (17), for instance an elastomer, having a refractive index adjusted to improve the optical coupling between the waveguides (9) and the optoelectronic component (11). The molding (17) covers advantageously all of said component (11) to also reduce thermal stresses between it and an exterior, protective layer (19) of a curable plastics material. The molded layer (17) can also cover the whole area of the waveguides (9) to form an upper cladding thereof. Guide grooves (5) are arranged in the silicon wafer (3) for positioning guide pins (7), utilized in the connection of the optocomponent (1) to another optocomponent having guides fo…