Method for cooling of chips using blind holes with customized depth
US5819402A · kind A · utility
30Cited by
10References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 4, 1997 |
| Grant date | Oct 13, 1998 |
| Priority date | — |
| Expiry date | Jun 4, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates generally to a new apparatus and method for customized cooling of chips. More particularly, the invention encompasses an apparatus and a method that provides customized cooling of a MCM (Multi-Chip Module) by varying the depth of thermal compound filled gap or the blind hole that is above each chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.