Reduced cavity depth screening stencil
US5819652A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 14, 1994 |
| Grant date | Oct 13, 1998 |
| Priority date | — |
| Expiry date | Dec 14, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24322
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An improved mask for screening a conductive paste onto a microelectronic substrate is disclosed. The mask comprises a metal foil having a thickness of less than about 200 microns, having a stencil formed in the foil and extending inwardly to a first depth from a first exterior surface of the foil, said stencil comprising a plurality of voids corresponding to the desired pattern, and having a mesh formed in the foil and extending inwardly to a second depth from a second exterior surface of the foil opposite said first exterior surface, said mesh comprising a plurality of voids in communication with the voids of the stencil, wherein the ratio of said first depth to said second depth is less than 60:40, and wherein the mask is produced from an essentially homogenous metal sheet. Such masks are useful for fabricating microelectronic substrates having screened lines of conductive paste.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.