Interconnecting blister package
US5819939A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 23, 1997 |
| Grant date | Oct 13, 1998 |
| Priority date | — |
| Expiry date | Oct 23, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S206/806
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A thermoformed thermoplastic blister is connected to a backing card. The blister has a peripheral flange which is positioned adjacent the backing card, and a bubble which protrudes frontwardly from the flange. A catch is formed in the flange, and is deformed rearwardly through an opening in the card to extend downwardly. The plastic catch extends into a narrow slot on the bubble of another like package. The slot is approximately the same width as the catch and need be only slightly taller than the thickness of the flange. With this connection structure multiple packages may be supported one upon another. In addition, the packages will automatically link to one another when extracted from a shipping carton. The rearwardly protruding catch may be formed from the plastic flange alone, or may be formed together with a portion of the backing card for additional strength. The plastic catch may be deformed by heat or pressure, or may be held in a rearwardly extending position by interaction with configured slots on the backing card. Alternatively, the flange may be molded to deform a portion of the backing card to act as the catch. More than one catch and slot may be formed in a package t…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.