Filling material composition used for a process of manufacturing a printed circuit board with plated through-holes
US5821279A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 25, 1996 |
| Grant date | Oct 13, 1998 |
| Priority date | — |
| Expiry date | Apr 25, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A radiation curable filling material is used for a process of manufacturing a printed circuit board having plated landless through-holes. The material is filled in the through-holes and solidified in the through-holes via a photo polymerization to protect plated through-hole interior from an etching solution. The composition comprises a hydrophthalic acid monoester compound as a component (A); a catalyst for promoting photo polymerization of a vinyl group in the mono ester as a component (B); a highly transparent rosin having a Hazen color tone of 300 or less for the improvement of filling material transmission by radiation as a component (C), a powder of extender as a competent (D). The photo polymerization reaction occurs at the vinyl group of the hydrophthalic mono ester with the presence of the catalyst for promoting the photo polymerization. The rate of the reaction is enhanced by adding a vinyl compound such as an acrylate. The superior transmission of the highly transparent rosin enables to increase cure depth of the filling material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.