Semiconductor die carrier having a dielectric epoxy between adjacent leads
US5821457A · kind A · utility
203Cited by
60References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 29, 1997 |
| Grant date | Oct 13, 1998 |
| Priority date | — |
| Expiry date | Jul 29, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor die carrier includes an insulative module; a plurality of electrically conductive leads extending from the insulative module; a semiconductor die housed with the insulative module; and at least one high frequency capacitor secured to the insulative module for facilitating transmission of high frequency signals carried to and from the semiconductor die on the electrically conductive leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.