Semiconductor device and process and leadframe for making the same
US5821611A · kind A · utility
19Cited by
6References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 6, 1995 |
| Grant date | Oct 13, 1998 |
| Priority date | — |
| Expiry date | Nov 6, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device which comprises a first lead having a tip formed with an island, a semiconductor chip unit mounted on the island of the first lead by means of a solder layer and having a plurality of electrode bumps projecting away from the island, and a plurality of additional leads each of which has a tip electrically connected to the electrode bumps via respective solder deposits. The additional leads include at least second and third leads. The tips of the second and third leads are at least partially wider than the semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.