Semiconductor chip package having clip-type outlead and fabrication method of same
US5821615A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 5, 1996 |
| Grant date | Oct 13, 1998 |
| Priority date | — |
| Expiry date | Dec 5, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49171
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip package having a clip type lead frame and fabrication thereof. The package includes a semiconductor chip having a plurality of bond pads thereon, a first package body having a recess, a plurality of inner leads each connected electrically to a corresponding one of the bond pads, a plurality of outleads each extended from a corresponding one of the inner leads for covering along sides of the first package body, and a second package body which covers the semiconductor chip, a plurality of metallic wires and the inner leads. The fabrication method includes the steps of forming a first package body having a recess therein, attaching to the first package body a plurality of inner leads and outleads extended from the inner leads thus to be coveringly exposed on sides of the first package body, attaching in the recess a semiconductor chip having a plurality of bond pads thereon, wire-bonding for electrically connecting each of the inner leads by a metallic wire to a corresponding one of the bond pads provided on the semiconductor chip, and forming a second package body for covering the semiconductor chip, the inner leads and the metallic wires.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.