Film carrier, semiconductor device using same and method for mounting semiconductor element
US5821626A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 25, 1996 |
| Grant date | Oct 13, 1998 |
| Priority date | — |
| Expiry date | Jun 25, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A film carrier comprising, on a laminate of an insulating layer and a conductive circuit, a conductive part to be connected to an external substrate and an energy introduction part to supply an energy to connect a semiconductor element, a semiconductor device, and a method for mounting a semiconductor element. The present invention has enabled provision of fine-pitched or highly dense wiring of a semiconductor element, and assures easy and dependable electric construction of the present invention wherein an energy for connection is supplied from the energy introduction part to make a connection of a film carrier to semiconductor element is advantageous in that attenuation of the energy for connection due to an insulating layer occurs less, since the energy for connection can be directly introduced into conductive circuit, thus enabling efficient utilization of the energy, which in turn permits easy and efficient mounting of a semiconductor element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.