Electronic circuit device
US5821627A · kind A · utility
71Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 5, 1997 |
| Grant date | Oct 13, 1998 |
| Priority date | — |
| Expiry date | Nov 5, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic circuit device includes a substrate, a wiring layer formed on the surface of the substrate and essentially consisting of at least one metal selected from the group consisting of gold, copper, tin, and aluminum, a bump formed on the wiring layer and essentially consisting of at least one metal selected from the group consisting of gold, copper, and aluminum, and a micro electronic element formed on the bump, wherein solid-phase diffusion bonding is performed at least either between the wiring layer and the bump or between the bump and an electrode of the micro electronic element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.