Heat pipes inserted into first and second parallel holes in a block for transferring heat between hinged devices
US5822187A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 25, 1996 |
| Grant date | Oct 13, 1998 |
| Priority date | — |
| Expiry date | Oct 25, 2016 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28D15/02
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
The apparatus is a device for transferring heat across the hinged joint between the two sections of the case of a laptop computer. Two simple heat pipe cylinders are inserted into parallel cylindrical holes in a heat conductive block. One cylinder is bonded within its hole, and the other cylinder is permitted to rotate within its hole. The axis of the rotatable cylinder is located in line with the axis of the mechanical hinges which permit the panels to pivot relative to each other. A heat producing device in one panel can be then attached to one heat pipe, and a heat sink on the other panel can be attached to the other heat pipe. The heat transfer between the heat source and the heat sink is essentially that of a heat pipe except for the very short heat conductive path through the solid block and the one rotating joint.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.