Laser texturing apparatus with dual laser paths having an independently adjusted parameter
US5822211A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 13, 1996 |
| Grant date | Oct 13, 1998 |
| Priority date | — |
| Expiry date | Nov 13, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B23/0028
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A disk texturing process uses a single pulsed laser to texture disks within a first group, which are carried through the texturing process on a first spindle assembly, and from a second group, which are carried through the texturing process on a second spindle assembly. Preferably, disks from the first group are textured alternately with disks in the second group. A first level of least one texturing parameter is stored for use only as the process is applied to disks from the first group, while a second level of the same texturing parameter is stored for use only as the process is applied to disks from the second group. These levels may be derived from measurements of textured spots made with interferometric devices forming portions of a texturing station.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.