Patent · US Expired

Method and apparatus for fabricating self-assembling microstructures

US5824186A · kind A · utility

256Cited by
2References
28Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 7, 1995
Grant dateOct 20, 1998
Priority date
Expiry dateJun 7, 2015

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/49895
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A method and apparatus for assembling microstructures onto a substrate through fluid transport. The microstructures being shaped blocks self-align into recessed regions located on a substrate such that the microstructure becomes integral with the substrate. The improved method includes a step of transferring the shaped blocks into a fluid to create a slurry. Such slurry is then dispensed evenly or circulated over the top surface of a substrate having recessed regions thereon. The microstructure via the shape and fluid tumbles onto the surface of the substrate, self-aligns, and engages into a recessed region.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.